Fengke Jingsheng lands in BDA, enhancing regional electronic materials supply chain

Beijing E-Town International Investment and Development Co., Ltd. (hereinafter referred to as "E-Town Capital"), ULVAC, Inc., and Ningbo Konfoong Materials International Co., Ltd. (hereinafter referred to as "KFMI") signed an industrial cooperation agreement on May 16, simultaneously formalizing the establishment of Beijing Fengke Jingsheng Electronic Materials Co., Ltd. (hereinafter referred to as "Fengke Jingsheng") in the Beijing Economic-Technological Development Area (referred to as "BDA" or "Beijing E-Town"). The project will pool the partners' respective strengths and resources, focus on electronic materials, and further strengthen the supporting infrastructure of the regional industrial supply chain.
The event was jointly organized by the administrative committee of the BDA, KFMI, and ULVAC Japan. Guests witnessing the signing included Wang Lei, deputy secretary of the working committee and director of the administrative committee of the BDA; Ouyang Zhongcan, academician of the Chinese Academy of Sciences; Chen Zhicheng, secretary of the Party Committee and chairman of E-Town Capital; Setsuo Iwashita, chairman and president of ULVAC Group; and Yao Lijun, founder and chief technology officer of KFMI.
At the signing ceremony, E-Town Capital, ULVAC Japan, and KFMI reached a deep strategic cooperation arrangement, launching comprehensive collaboration in core areas including electronic materials, vacuum coating technology, and industrial collaborative innovation. As the core outcome of this trilateral strategic cooperation, Fengke Jingsheng officially signed to land in BDA. Currently, BDA possesses a strong foundation in the new display industry and has formed a well-established industrial clustering layout. Driven by leading enterprises such as BOE, the area has gathered a number of upstream and downstream supporting enterprises including Corning Display, TPV Technology, and Chipone Technology, establishing a complete industry chain from display chips, glass substrates, polarizers, and display panels to terminal applications. However, despite sufficient downstream terminal production capacity in the industry chain, there remains a notable gap in supporting upstream core materials such as high-end sputtering targets. Fengke Jingsheng, which is landing in the area, will focus on core businesses including R&D, manufacturing, and sales of specialty electronic materials, systematically integrating the technology, assets, and business resources of KFMI and ULVAC Japan in the advanced materials field, and precisely enhancing regional upstream materials support. By building a professional advanced materials platform integrating R&D, pilot testing, and volume production, Fengke Jingsheng will provide advanced materials solutions to downstream users in the Beijing-Tianjin-Hebei region, helping BDA further improve its industrial ecosystem and strengthen regional industrial core competitiveness.
An official from the relevant departments of BDA said that high-end electronic materials represent a key high-precision industry track prioritized by the area. The area places great emphasis on shoring up weaknesses in upstream core segments, continuously gathering high-quality industrial resources from home and abroad, and improving high-end materials industry chain support. This trilateral cooperation and the landing of the Fengke Jingsheng project represent an important practice by the area to strengthen its electronic materials industry cluster and optimize its industrial spatial layout. The area will continue to provide robust factor guarantees and policy support to create favorable conditions for major projects.
An official from E-Town Capital stated that E-Town Capital has long been committed to industrial development and capital-driven growth within BDA. Its strategic partnership with leading industry players marks a key move to leverage capital to attract high-end industrial projects and strengthen the advanced materials supply chain. Going forward, the company will capitalize on the advantages of its State-owned investment platform to coordinate resources across industry, capital, and policy, helping ensure the partner project moves swiftly into construction and production. It will also continue to expand BDA's electronic materials industry portfolio and support the upgrading of the region's advanced manufacturing sector.
Yao Lijun, founder and chief technology officer of KFMI, said that advanced materials are a critical foundation of industrial development and a key area for technological breakthroughs. KFMI will leverage its accumulated expertise in ultra-high-purity metals to work with its partners on the R&D and localized production of high-end sputtering targets, further improving supply chain stability and self-sufficiency.
Setsuo Iwashita, chairman and president of ULVAC Group, said that China is a core market for the global electronics industry and that BDA offers significant advantages as an industrial hub. ULVAC will draw on its technological expertise in vacuum coating and electronic materials to work with its Chinese partners to adapt and deploy relevant technologies in the Chinese market.
The strategic partnership and project launch mark an important step for BDA in filling supply chain gaps, extending industrial value chains, strengthening key segments, and improving the electronic materials ecosystem. They also demonstrate how cross-border industrial collaboration, capital investment, and technological innovation can work together to advance industrial development. Looking ahead, the partners will deepen industrial collaboration, promote technological exchange, and share resources, with a continued focus on advanced materials R&D and manufacturing. By addressing critical technological bottlenecks and further leveraging BDA's industrial clustering advantages, they aim to establish a new benchmark for industrial development characterized by international cooperation, integration of research and manufacturing, and mutually beneficial growth.




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